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Product Detailed Parameters
- Description：INTERCONNECT RECTANGULAR
- Series：ComboStak®
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：-
- Number of Positions：150 (140 + 10 Power)
- Number of Rows：2
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Board
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.185" (4.70mm)
- Contact Shape：Rectangular
- Contact Finish - Mating：Gold, GXT™
- Contact Finish Thickness - Mating：8.00µin (0.203µm)
- Contact Finish - Post：Gold, Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Pick and Place, Solder Retention
- Operating Temperature：-55°C ~ 125°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：-
- Voltage Rating：100VDC
Download product information
Overview
The Amphenol ICC (FCI) part number 10159558-AA4121RLF is a COMBOSTAK P1 series connector header designed for surface mount technology. It features a total of 150 positions, configured as 140 signal contacts and 10 power contacts. The component utilizes a multipitch design to accommodate varying pin spacing requirements within a single housing. This high-density interconnect solution is intended for robust electrical connections in demanding electronic assemblies.
Feature Summary
- COMBOSTAK P1 series construction for high-density applications
- Multipitch configuration supporting mixed signal and power routing
- Surface mount termination style for automated assembly
- Integrated design combining 140 signal and 10 power positions
Applications
- High-density server backplanes
- Industrial control system interconnects
- Telecommunications infrastructure equipment
- Complex electronic module interfaces
Procurement Notes
Verify the specific AA4121RLF suffix against the manufacturer's latest datasheet to confirm exact pinout and contact material specifications. Ensure compatibility with the mating COMBOSTAK receptacle housing. Check for any recent Product Change Notifications (PCN) regarding material updates or packaging modifications before finalizing procurement orders.
Selection Notes
Select this component when a high-pin-count surface mount header is required with distinct signal and power channel separation. The multipitch design allows for optimized trace routing on printed circuit boards. Confirm that the PCB footprint matches the specified dimensions for both signal and power contact areas to ensure proper mechanical retention and electrical performance.
Part Context
This part belongs to the Amphenol ICC COMBOSTAK P1 family, which specializes in high-density, high-reliability interconnect solutions. The series is engineered for applications requiring significant I/O density in compact form factors. The 10159558 base number indicates the core housing design, while the suffix defines the specific contact arrangement and pitch configuration.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify cross-reference options directly with Amphenol ICC technical support using the full part number and application requirements.
