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Product Detailed Parameters
- Description：10163894-1240100LF-MTK CEM5 HYB
- Series：*
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：-
- Contact Type：-
- Pitch - Mating：-
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- Number of Rows：-
- Row Spacing - Mating：-
- Number of Positions Loaded：-
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- Contact Length - Mating：-
- Contact Length - Post：-
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- Contact Finish - Mating：-
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：-
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- Insulation Material：-
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Overview
The Amphenol ICC (FCI) part number 10163894-1240100LF is a Minitek Pwr 3.0 series header connector featuring male pin contacts. It is designed for surface mount termination and provides reliable power distribution in compact electronic assemblies.
Feature Summary
- Minitek Pwr 3.0 series design optimized for high-density power applications
- Male pin contact type ensures secure mating with corresponding receptacles
- Surface mount termination facilitates automated assembly processes
Applications
- Server and storage equipment power distribution
- Communication device internal interconnects
- Industrial control system board-to-cable connections
Procurement Notes
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm exact contact count, pitch, and termination style. Ensure compatibility with existing PCB footprints and mating components before finalizing procurement orders.
Selection Notes
Select this component when a low-profile, surface-mount header with male pins is required for power circuits. The Minitek Pwr 3.0 series offers a balance of current carrying capacity and spatial efficiency suitable for dense packaging requirements.
Part Context
This component belongs to the Minitek Pwr 3.0 family produced by Amphenol ICC (formerly FCI). The series is widely utilized in data communication and industrial sectors for robust wire-to-board or board-to-board power interconnections requiring high reliability.
Replacement Considerations
Direct substitutes may include other Minitek Pwr 3.0 headers from Amphenol ICC with matching pin counts and mounting styles. Cross-reference with competitor high-density SMD power headers if supply constraints exist.
