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Product Detailed Parameters
- Description：1.0MM PITCH, HEADER, VER-TICAL,
- Series：FitMate
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR),Cut Tape (CT)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.039" (1.00mm)
- Number of Positions：30
- Number of Rows：2
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.163" (4.15mm)
- Contact Shape：Rectangular
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Gold
- Contact Material：Phosphor Bronze
- Insulation Material：Polyamide (PA9T), Nylon 9T
- Features：Board Guide, Pick and Place, Solder Retention
- Operating Temperature：-25°C ~ 85°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：1A
- Voltage Rating：50VAC/DC
Download product information
Overview
The Amphenol ICC (FCI) part number 10164212-30011LF is a Flip CEM connector designed for PCI Express Gen 5 applications. It features a dual-row configuration with 164 total positions, arranged as 11 contacts per grid across two rows of 71. The connector utilizes a 1.00mm pitch and accepts cards with a thickness of 1.57mm. It employs gold-plated cantilever contacts with a thickness of 0.76µm and is constructed from glass-filled resin insulation. Designed for surface mount termination, the unit is black in color and includes board guide rails and locking pin slides for secure installation.
Feature Summary
- Supports high-speed signal transmission compliant with PCI Express Gen 5 standards
- Features a flip card edge mounting mechanism for efficient assembly
- Incorporates cantilever contact technology to ensure reliable electrical engagement
Applications
- High-performance server motherboards
- Data center acceleration cards
- Enterprise storage systems
Procurement Notes
Verify that the specific ordering suffix matches the required packaging and plating specifications. Confirm compatibility with the target PCB footprint and mating card dimensions. Ensure the component meets RoHS compliance requirements for the intended market. Cross-reference the manufacturer datasheet for precise mechanical tolerances before finalizing the design integration.
Selection Notes
Select this component when a low-profile, high-density interface is required for next-generation PCIe expansion slots. The 1.00mm pitch allows for significant I/O density within constrained board areas. Consider the flip-mount style if space constraints prevent traditional through-hole or standard SMT edge connectors. Evaluate the thermal performance characteristics against the system's heat dissipation strategy.
Part Context
This component belongs to the Flip CEM series by Amphenol ICC (FCI), formerly Framatome Connectors International. The brand specializes in high-reliability interconnect solutions for demanding computing environments. This specific model represents an evolution in edge card connectivity, focusing on maintaining signal integrity at higher data rates while reducing the overall profile of the connection interface.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify mechanical fitment and electrical continuity carefully when considering alternative sources. Ensure any replacement maintains the same contact material, plating thickness, and insulation properties.
