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The Amphenol ICC (FCI) part number 10164213-50011LF is a Minitek Multipitch connector system component. It is an 8-position receptacle housing designed for wire-to-board applications. The connector features a single row with a pitch of 1.50mm (0.059 inches). It utilizes a natural-colored polyamide (PA66) insulation material and supports crimp termination for contacts. The assembly includes Connector Position Assurance (CPA) and Terminal Position Assurance (TPA) features to ensure secure mating and contact retention. The operating temperature range is specified from -40°C to 105°C.
Verify the specific revision level against official Amphenol documentation before integration, as manufacturing updates may occur. Confirm that the required crimp contacts are ordered separately, as they are not included with the housing. Ensure compliance with RoHS directives if applicable to the target market, noting that this specific suffix indicates lead-free status. Cross-reference the pinout configuration with the mating header to guarantee correct polarity and alignment during assembly.
Select this housing when a 1.50mm pitch is required for space-constrained designs. The inclusion of CPA and TPA makes it suitable for high-vibration environments where contact displacement must be prevented. Compare against standard housings to determine if the added assurance features justify the design complexity. Ensure the mating cable gauge aligns with the crimp contact specifications provided in the series datasheet.
This component belongs to the Minitek Multipitch series by Amphenol ICC (FCI), which focuses on cost-effective, high-density interconnect solutions. The series is widely used in telecommunications and industrial sectors. The 10164213-50011LF variant specifically addresses the need for reliable 8-position connections with enhanced mechanical locking features compared to basic housings.
Direct replacements within the same series include other 8-position Minitek Multipitch receptacles with identical 1.50mm pitch and CPA/TPA features. Verify that any substitute maintains the same insulation material properties and terminal size compatibility. Check for any changes in mounting orientation or housing height that might affect PCB layout constraints.