103R-272H

Overview

The Delevan 103R-272H is a fixed surface-mount RF inductor with an inductance of 2.7 µH and a tolerance of 3%. It features a maximum DC resistance of 1.15 Ohms and a rated current of 290 mA. The component utilizes a nonstandard two-lead design suitable for SMT applications.

Feature Summary

• Fixed inductance value optimized for RF circuit stability
• Surface-mount technology compatible construction
• Shielded or unshielded core configuration depending on specific variant requirements

Applications

• RF signal processing circuits
• Impedance matching networks
• Filtering stages in communication equipment

Procurement Notes

Verify the exact physical lead configuration against schematic requirements, as the part is described with both standard and nonstandard lead types across sources. Confirm RoHS compliance status directly with the supplier, as documentation varies between compliant and non-compliant records. Ensure the 290 mA current rating meets the specific application load demands before finalizing procurement.

Selection Notes

Select this component when a precise 2.7 µH inductance is required for high-frequency applications. The low current rating of 290 mA limits suitability to low-power signal paths rather than power delivery lines. Compare the 1.15 Ohm DC resistance against circuit loss budgets to ensure signal integrity is maintained within acceptable limits for the target frequency range.

Part Context

This component belongs to the Delevan fixed inductor family, specifically designed for radio frequency applications. It serves as a passive energy storage element in oscillators and filters. The manufacturer API Delevan specializes in magnetic components for telecommunications and industrial electronics, providing reliable performance in compact form factors.

Replacement Considerations

Direct substitutes include other 2.7 µH RF inductors from manufacturers such as Coilcraft or Murata. Verify that replacement parts match the 290 mA current rating and 1.15 Ohm resistance specifications. Ensure the footprint and lead style are compatible with existing PCB layouts to avoid mechanical integration issues.