103R-391HS

Overview

The Delevan 103R-391HS is a surface-mount RF inductor with an inductance of 390 nH and a tolerance of 3%. It features an unshielded design, a maximum DC resistance of 240 mOhms, and a rated current of 635 mA. The component has a minimum Q factor of 24 and a self-resonant frequency of 280 MHz. Its physical dimensions are 2.54 mm in length, 2.54 mm in width, and 1.91 mm in height. It utilizes standard terminations for PCB mounting.

Feature Summary

• Unshielded construction suitable for applications requiring minimal magnetic interference
• Designed for high-frequency radio frequency signal processing
• Surface mount technology enables automated PCB assembly

Applications

• RF filtering circuits
• Impedance matching networks
• High-frequency signal conditioning

Procurement Notes

Verify the specific manufacturer designation, as API Delevan assets may be managed by other entities. Confirm RoHS compliance status through official documentation. Ensure the ordering suffix matches the required packaging configuration. Validate that the unshielded variant meets the electromagnetic compatibility requirements of the target system before finalizing procurement.

Selection Notes

Select this component when an unshielded RF inductor is required to prevent magnetic coupling issues. The 390 nH value and 280 MHz self-resonant frequency suit specific high-frequency bands. Consider the 635 mA current rating against circuit load requirements. The non-standard lead configuration must align with the PCB footprint design constraints.

Part Context

This part belongs to the 103/R series of fixed RF inductors manufactured by Delevan. It is categorized under SMD RF inductors designed for compact electronic assemblies. The series provides options for various inductance values within the nano-Henry range, supporting diverse radio frequency circuit architectures.

Replacement Considerations

Direct substitutes include the 103R-391J for similar electrical characteristics with different tolerance. The 103-391HS offers comparable performance with potential packaging variations. Verify pinout compatibility and thermal specifications when evaluating alternative components from the same manufacturer family.