103R-682K

Overview

The Delevan 103R-682K is a surface-mount RF inductor with an inductance of 6.8 µH and a tolerance of ±10%. It features a maximum DC resistance of 2.2 Ohms and a rated current of 210 mA. The component utilizes a non-standard, two-lead SMD package measuring approximately 2.54 mm by 2.54 mm. Designed for radio frequency applications, it operates within a temperature range of -55°C to +125°C.

Feature Summary

• Surface-mount construction with non-standard two-lead configuration
• Unshielded design suitable for RF circuit integration
• Ferrite core material for stable inductance performance

Applications

• Radio frequency signal processing circuits
• RF choke applications in communication modules
• General purpose RF filtering networks

Procurement Notes

Verify the specific manufacturer part number against official API Delevan documentation to confirm electrical parameters and physical dimensions. Ensure compatibility with PCB footprint requirements due to the non-standard lead configuration. Cross-reference RoHS compliance status using current regulatory declarations from the manufacturer before finalizing procurement orders.

Selection Notes

Select this component when a 6.8 µH unshielded RF inductor is required for space-constrained designs. The 210 mA current rating and 2.2 Ohm DCR define its power handling limits. Consider the non-standard package dimensions during layout planning to ensure proper soldering and mechanical stability in the target assembly.

Part Context

This component belongs to the Delevan 103 series of fixed RF inductors. These parts are characterized by their compact surface-mount form factor and use of ferrite cores. The series is engineered for high-frequency applications where standard shielded packages may not fit or where magnetic shielding is unnecessary for the specific circuit topology.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Verify functional equivalence with other 6.8 µH SMD RF inductors based on current rating, DCR, and package footprint constraints.