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Product Detailed Parameters
- Description:FIXED IND 33UH 45MA 13 OHM SMD
- Series:108
- Mfr:Delevan
- Package:Tape & Reel (TR)
- Type:-
- Material - Core:Iron
- Inductance:33 µH
- Tolerance:±5%
- Current Rating (Amps):45 mA
- Current - Saturation (Isat):-
- Shielding:Unshielded
- DC Resistance (DCR):13Ohm Max
- Q @ Freq:30 @ 2.5MHz
- Frequency - Self Resonant:12MHz
- Ratings:-
- Operating Temperature:-55°C ~ 125°C
- Inductance Frequency - Test:2.5 MHz
- Mounting Type:Surface Mount
- Package / Case:Nonstandard, 2 Lead
- Supplier Device Package:-
- Size / Dimension:0.100" L x 0.100" W (2.54mm x 2.54mm)
- Height - Seated (Max):0.075" (1.91mm)
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Overview
The Delevan 108-333J is an unshielded surface-mount fixed inductor designed for RF applications. It features a nominal inductance of 33 uH with a tolerance of 3%. The component has a maximum DC resistance of 13 Ohms and supports a maximum DC current of 45 mA. Its self-resonant frequency is 12 MHz, with a minimum Q factor of 30. The physical dimensions are 0.1 inches in length, width, and height.
Feature Summary
- Unshielded SMD construction suitable for high-frequency circuits
- Ferrite core design for stable inductance characteristics
- Standard termination style for PCB mounting
Applications
- RF circuit filtering
- Impedance matching networks
- High-frequency signal processing
Procurement Notes
Verify RoHS compliance status as documentation indicates non-compliance. Confirm lead times and factory order requirements directly with the manufacturer or authorized distributors. Ensure the specific suffix matches the required tolerance and packaging format for your production needs.
Selection Notes
Select this component for applications requiring 33 uH inductance in compact SMD form factors. Consider the low current rating of 45 mA when designing power stages. Verify that the 12 MHz self-resonant frequency aligns with the target operating range to ensure effective performance in RF environments.
Part Context
This part belongs to the API Delevan fixed inductor family, specifically tailored for radio frequency and general-purpose electronic applications. It utilizes a chip-style SMT package to facilitate automated assembly processes while maintaining reliable electrical performance in constrained board spaces.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult manufacturer cross-reference guides for compatible alternatives with similar electrical specifications and footprint dimensions.
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