1081413

Overview

The SICK part number 1081413 corresponds to the V2D611P-MMSCI4, a 2D snapshot sensor designed for quality inspection tasks. It utilizes a CMOS global shutter technology with an adjustable optical focus and integrated visible LED illumination in blue (470 nm) and amber (617 nm). The device features a working area of 50 mm by 300 mm when using internal lighting. It includes a green feedback LED and a red auxiliary alignment LED. The unit is classified as Laser Class 1, complying with 21 CFR 1040.10 standards. It supports programming via Nova Inspector software and integrates the SICK Algorithmus API HALCON toolkit.

Feature Summary

• Equipped with CMOS global shutter technology for precise image capture without motion distortion.
• Features adjustable optical focus to accommodate varying working distances and field of view requirements.
• Includes integrated multi-color LED illumination system with blue and amber light sources for enhanced material contrast.
• Supports intelligent inspection upgrades through licensed software tools and HALCON algorithm integration.

Applications

• Quality inspection in manufacturing environments
• Automated visual verification processes
• Industrial machine vision applications requiring high precision

Procurement Notes

Verify the exact ordering suffix against official SICK documentation to ensure correct configuration. Confirm that the required software licenses, such as the Quality Inspection License or Intelligent Inspection Upgrade License, are included or purchased separately. Check compatibility with existing control systems and ensure proper mounting hardware is available for installation.

Selection Notes

Select this model if the application requires a compact 2D snapshot sensor with integrated lighting and programmable intelligence. Consider the working area dimensions and focus range relative to the target object size. Ensure that the necessary software licenses for advanced inspection algorithms are accounted for during the selection process.

Part Context

This component belongs to the V2D series of 2D snapshot sensors from SICK. These sensors are engineered for industrial automation, combining imaging capabilities with onboard processing power. The series is designed to replace traditional camera setups with more robust, all-in-one solutions suitable for harsh factory conditions.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Consult official SICK documentation for cross-references or newer generation replacements.