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Product Detailed Parameters
- Description:FIXED IND 18UH 75MA 4.4 OHM SMD
- Series:108R
- Mfr:Delevan
- Package:Tape & Reel (TR)
- Type:-
- Material - Core:Iron
- Inductance:18 µH
- Tolerance:±1%
- Current Rating (Amps):75 mA
- Current - Saturation (Isat):-
- Shielding:Unshielded
- DC Resistance (DCR):4.4Ohm Max
- Q @ Freq:32 @ 2.5MHz
- Frequency - Self Resonant:21MHz
- Ratings:-
- Operating Temperature:-55°C ~ 125°C
- Inductance Frequency - Test:2.5 MHz
- Mounting Type:Surface Mount
- Package / Case:Nonstandard, 2 Lead
- Supplier Device Package:-
- Size / Dimension:0.100" L x 0.100" W (2.54mm x 2.54mm)
- Height - Seated (Max):0.075" (1.91mm)
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Overview
The Delevan 108R-183FS is a fixed surface-mount inductor designed for RF applications. It features an 18 µH nominal inductance with a 75 mA maximum DC current rating and a 4.4 Ohm maximum DC resistance. The component utilizes a nonstandard, two-lead SMD package construction.
Feature Summary
- Designed for radio frequency signal processing
- Surface-mount installation format
Applications
- RF circuit filtering
- Signal conditioning networks
Procurement Notes
Verify the active lifecycle status through official API Delevan channels before integration. Confirm RoHS compliance requirements against specific project standards. Ensure the nonstandard lead configuration matches the target PCB footprint design to prevent assembly errors.
Selection Notes
Select this component when an 18 µH value is required within a 75 mA current limit. The 4.4 Ohm resistance characteristic suits low-power RF paths. Evaluate the physical dimensions of the nonstandard package against available board space constraints.
Part Context
This part belongs to the 108R series of micro chip inductors manufactured by API Delevan. The series provides passive components for electronic circuits, specifically targeting applications requiring fixed inductance values in compact surface-mount formats.
Replacement Considerations
The 108R-183K is a documented variant within the same product family. Verify electrical parameter compatibility and package alignment before substitution.
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