10AS032E1F27I1HG

10AS032E1F27I1HG

$2,352.39
  • Description:IC SOC CORTEX-A9 1.5GHZ 672FBGA
  • Series:Arria 10 SX

SKU:6eb78a8adf14 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A9 1.5GHZ 672FBGA
  • Series:Arria 10 SX
  • Mfr:Altera
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, POR, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.5GHz
  • Primary Attributes:FPGA - 320K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:672-BBGA, FCBGA
  • Supplier Device Package:672-FBGA, FC (27x27)

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10AS032E1F27I1HG

Overview

The Altera 10AS032E1F27I1HG is an Arria 10 SX SoC FPGA featuring a dual-core ARM Cortex-A9 processor with a maximum clock frequency of 1.2 GHz. It includes 2 x 32 kB L1 instruction and data caches per core. The device provides 320,000 logic elements (LE), 119,900 adaptive logic modules (ALM), and 33,750 logic array blocks (LAB). Embedded memory capacity is 17.4 Mbit. It integrates 24 high-speed transceivers supporting data rates up to 17.4 Gb/s. The component operates within a temperature range of 0°C to +100°C and utilizes an FBGA-1152 package.

Feature Summary

  • Integrates a dual-core ARM Cortex-A9 processor subsystem for embedded control tasks
  • Provides extensive programmable logic resources including over 300,000 logic elements
  • Supports high-speed serial communication via multiple integrated transceivers
  • Features significant on-chip embedded memory for data storage and processing

Applications

  • High-performance networking infrastructure equipment
  • Industrial automation and control systems
  • Medical imaging devices requiring complex signal processing
  • Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against official Intel/Altera documentation to ensure correct temperature grade and package variant. Confirm RoHS compliance status through current datasheets. Check for any Product Change Notifications (PCN) that may affect pinout or electrical characteristics prior to final design freeze.

Selection Notes

Compare logic element count and transceiver bandwidth against system requirements to ensure adequate resource headroom. Evaluate the dual-core ARM processor performance relative to real-time operating system demands. Consider thermal management solutions suitable for the FBGA-1152 package under maximum load conditions.

Part Context

This part belongs to the Arria 10 SX family, designed for cost-sensitive applications requiring moderate performance. It sits between lower-density models like the 10AS016 and higher-capacity variants in the series. The F27 designation indicates a specific pin count and package configuration within the broader product line.

Replacement Considerations

Direct replacements are limited within the same family. Verify compatibility with existing PCB footprints when considering adjacent models such as 10AS032H1F35E1HG or 10AS032E1F29E1HG, noting differences in transceiver counts and package sizes.

10AS032E1F27I1HG10AS032E1F27I1HG
$2,352.39
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