10AS057H1F34I1SG

Overview

The Altera 10AS057H1F34I1SG is an Arria 10 AS FPGA featuring 568,000 logic elements and 210,880 adaptive logic modules. It integrates 30.9 Mbit of embedded memory and supports up to 576 I/Os. The device operates with a core voltage range of 870 mV to 980 mV and includes 24 transceivers capable of 17.4 Gb/s data rates. It utilizes an FBGA-1152 package for surface mount installation and functions within a temperature range of -40°C to +100°C.

Feature Summary

• Integrates the Hard Processor System (HPS) combining ARM Cortex-A9 cores with FPGA fabric
• Supports high-speed serial communication via integrated transceivers
• Provides extensive on-chip memory resources for data buffering and processing

Applications

• Telecommunications infrastructure equipment
• Industrial automation control systems
• Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix to confirm the exact speed grade and commercial temperature rating required for your design. Confirm RoHS compliance status and export control classification codes prior to purchase. Ensure that the supplier provides valid traceability documentation for this programmable logic component.

Selection Notes

Select this model when system requirements demand both processor integration and reconfigurable logic within a single die. Evaluate the total available logic elements against your design footprint needs. Consider the number of required high-speed serial lanes to ensure sufficient transceiver availability for your interface protocols.

Part Context

This part belongs to the Arria 10 AS series, which combines the flexibility of FPGA fabric with the efficiency of an embedded ARM processor. It targets applications requiring low power consumption and high performance in compact form factors compared to larger Stratix devices.

Replacement Considerations

Direct pin-to-pin replacements are not publicly documented for this specific variant. Upgrades may require redesigning the PCB layout due to differences in pin assignments or thermal characteristics between device families.