10AS057H3F34I2SG

Overview

The Altera 10AS057H3F34I2SG is an Arria 10 SX 570 SoC FPGA featuring a dual-core ARM Cortex-A9 processor. It provides 570,000 logic elements and 217,080 adaptive logic modules within an FBGA-1152 package. The device integrates 35.16 Mbit of embedded memory and supports up to 36 transceivers operating at data rates of 17.4 Gb/s. It operates with a core voltage range of 870 mV to 980 mV and functions within a commercial temperature range of 0°C to +100°C.

Feature Summary

• Integrates a hard processor system with dual ARM Cortex-A9 cores for combined processing and programmable logic capabilities.
• Provides high-density programmable fabric with over half a million logic elements and extensive embedded memory resources.
• Supports high-speed serial communication through multiple integrated transceivers capable of 17.4 Gb/s operation.

Applications

• High-performance test and measurement instrumentation requiring low latency and flexible I/O standards.
• Industrial automation systems utilizing real-time control and signal processing.
• Telecommunications infrastructure equipment requiring high-speed data interface support.

Procurement Notes

Verify the specific ordering suffix against official Intel/Altera documentation to confirm package type, temperature grade, and speed grade. Ensure compliance with export regulations as indicated in distributor listings. Confirm component authenticity through authorized supply channels to avoid counterfeit risks associated with legacy semiconductor products.

Selection Notes

Select this model when system requirements demand a balance between significant logic capacity and embedded processing power. Compare against the 10AS057K variant if higher I/O counts or different pin configurations are necessary. Evaluate thermal management solutions suitable for the FBGA-1152 package under maximum load conditions within the specified commercial temperature range.

Part Context

This component belongs to the Arria 10 SX family, designed for scalable performance in cost-sensitive applications. It bridges the gap between standard FPGAs and complex SoC devices by integrating hardened processor subsystems. The series targets markets requiring adaptable hardware architectures with substantial computational throughput.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with existing board layouts and software toolchains before considering alternative devices from the same product family.