10AX027E2F27I1SG

10AX027E2F27I1SG

  • Description:IC FPGA 240 I/O 672FBGA
  • Series:Arria 10 GX

SKU:05489a619e74 Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 240 I/O 672FBGA
  • Series:Arria 10 GX
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:101620
  • Number of Logic Elements/Cells:270000
  • Total RAM Bits:17870848
  • Number of I/O:240
  • Voltage - Supply:0.87V ~ 0.98V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:672-BBGA, FCBGA
  • Supplier Device Package:672-FBGA (27x27)
  • Grade:-
  • Qualification:-

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10AX027E2F27I1SG

Overview

The Altera 10AX027E2F27I1SG is an Arria 10 GX FPGA featuring 270,000 logic elements and 101,620 adaptive logic modules. It integrates 14.65 Mbit of embedded memory and supports data rates up to 17.4 Gb/s via its transceiver architecture. The device operates within a core voltage range of 870 mV to 930 mV and functions reliably between -40°C and +100°C. Packaged in an FBGA-1152 format, it is designed for high-performance programmable logic applications requiring robust I/O capabilities and advanced signal processing features.

Feature Summary

  • Integrates dual-core ARM Cortex-A9 processors for system-on-chip functionality
  • Supports high-speed serial communication with transceivers operating at 17.4 Gb/s
  • Features extensive embedded memory resources for complex data buffering and storage

Applications

  • High-speed networking infrastructure equipment
  • Industrial automation control systems
  • Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against official Intel/Altera documentation to ensure correct temperature grade and package variant. Confirm export compliance requirements as this component may be subject to international trade regulations. Check for product change notifications regarding manufacturing updates or lifecycle status before finalizing procurement plans.

Selection Notes

Compare the 270K LE density against project requirements to avoid over-specification. Ensure the FBGA-1152 footprint matches the PCB layout constraints. Verify that the available I/O count and transceiver lanes meet the interface specifications. Consider thermal management solutions given the operational temperature range and power consumption characteristics.

Part Context

This part belongs to the Arria 10 GX family, which combines FPGA fabric with embedded processor cores. It targets applications needing both programmable logic flexibility and processing power. The series is known for integrating HBM support and high-speed transceivers for demanding data throughput tasks.

Replacement Considerations

Direct substitutes include other Arria 10 GX variants with similar logic densities such as 10AX027H2F35I1SG or 10AX027H3F35I2LG. Cross-family migration to Stratix 10 may require significant design revalidation due to architectural differences.

10AX027E2F27I1SG10AX027E2F27I1SG

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