10AX027H2F35I1HG

10AX027H2F35I1HG

$2,019.16
  • Description:IC FPGA 384 I/O 1152FBGA
  • Series:Arria 10 GX

SKU:b393d0e00065 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 384 I/O 1152FBGA
  • Series:Arria 10 GX
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:101620
  • Number of Logic Elements/Cells:270000
  • Total RAM Bits:17870848
  • Number of I/O:384
  • Voltage - Supply:0.87V ~ 0.98V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1152-BBGA, FCBGA
  • Supplier Device Package:1152-FCBGA (35x35)
  • Grade:-
  • Qualification:-

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10AX027H2F35I1HG

Overview

The Altera 10AX027H2F35I1HG is an Arria 10 GX 270 Field Programmable Gate Array housed in a 1152-ball FBGA package. It provides 270,000 logic elements and 101,620 Adaptive Logic Modules for complex digital design. The device integrates 14.65 Mbit of embedded memory and supports up to 384 I/O pins. It features 24 transceivers capable of data rates up to 17.4 Gb/s. Operating voltage ranges from 870 mV to 980 mV with a nominal 950 mV. The component operates within a commercial temperature range of 0°C to +100°C and supports maximum frequencies up to 1.5 GHz.

Feature Summary

  • Integrates high-speed serial transceivers supporting multi-gigabit data transmission standards
  • Provides scalable logic resources through adaptive logic modules for flexible system integration
  • Includes substantial on-chip memory blocks for efficient data buffering and processing

Applications

  • High-speed data acquisition systems requiring low latency processing
  • Test and measurement instruments utilizing parallel signal processing
  • Protocol analysis platforms adapting to various interface standards

Procurement Notes

Verify the specific suffix codes against official Intel/Altera documentation to confirm temperature grade and package variant accuracy. Ensure compliance with export control classifications such as ECCN 3A991 if applicable to your region. Confirm moisture sensitivity handling requirements prior to assembly to maintain device integrity during soldering processes.

Selection Notes

Select this model when the design requires the specific resource density of the Arria 10 GX 270 family. Compare against the 10AS series if System-on-Chip capabilities are needed instead of pure FPGA logic. Verify that the 1152-ball FBGA footprint matches the target PCB layout constraints and thermal management strategy.

Part Context

This component belongs to the Arria 10 GX series, designed for high-performance general-purpose applications. It sits below larger capacity devices like the 10AX048 in the same package family. The part represents a balance between logic density and power efficiency for mid-range programmable logic implementations.

Replacement Considerations

Direct pin-compatible replacements within the same package may include other Arria 10 GX variants with different logic densities. Cross-family migration to Agilex or Stratix requires significant redesign due to architectural differences.

10AX027H2F35I1HG10AX027H2F35I1HG
$2,019.16
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