10M221J

Overview

The Gowanda Electronics 10M221J is a general-purpose axial leaded inductor designed for RF applications. It features an unshielded wirewound construction with a powdered iron core, providing a nominal inductance of 2.2 µH and a maximum DC resistance of 400 mΩ. The component supports a rated current of 395 mA and operates within a temperature range of -55 °C to 125 °C. It utilizes a tubular package form with standard axial leads.

Feature Summary

• Unshielded wirewound design suitable for radio frequency environments
• Powdered iron core material for stable general-purpose performance
• Axial leaded packaging for through-hole mounting compatibility

Applications

• RF coil circuits
• General purpose inductive filtering
• Signal processing components

Procurement Notes

Verify the specific tolerance suffix (J) against project requirements to ensure the 5% inductance accuracy aligns with circuit specifications. Confirm that the axial lead dimensions and thermal ratings are compatible with the intended PCB layout and operating environment conditions before finalizing procurement orders.

Selection Notes

Select this component when an unshielded axial inductor is required for RF or general-purpose applications. The powdered iron core offers distinct characteristics compared to ferrite cores, making it suitable for specific frequency ranges. Ensure the 395 mA current rating meets the peak load demands of the target circuit design.

Part Context

This part belongs to the Gowanda 10M series of fixed inductors, which provides a wide range of inductance values in axial leaded packages. The series is characterized by its molded construction and availability in various core materials to suit different electrical performance needs across industrial and electronic applications.

Replacement Considerations

Cross-reference with other Gowanda 10M series variants such as 10M220KLF or 10M220MLF if different tolerance levels or lead-free compliance are required. Verify that substitute parts maintain identical inductance values and physical footprint constraints.