10M270JLF

Overview

The 10M270JLF is a general purpose axial leaded inductor manufactured by Gowanda Electronics. It features an iron-ferrite core and wirewound construction with a nominal inductance of 270 µH and a tolerance of ±5%. The component has a maximum DC resistance of 3.2 Ω and a rated current of 960 mA. It operates within a temperature range of -55 °C to 105 °C. This RoHS-compliant part utilizes a rectangular package configuration suitable for through-hole mounting.

Feature Summary

• Axial leaded construction for through-hole integration
• Iron-ferrite core material for stable performance
• RoHS compliant manufacturing standard

Applications

• RF coil circuits
• General purpose filtering applications
• Industrial electronic systems

Procurement Notes

Verify the specific suffix designation to confirm compliance status, as traditional versions may differ from RoHS-compliant variants. Confirm that the axial lead length and diameter match the target PCB layout requirements. Ensure the operating temperature range aligns with the environmental conditions of the final assembly. Cross-reference the manufacturer's latest documentation to validate the electrical parameters against current production batches.

Selection Notes

Select this component when an axial leaded form factor is required for manual or wave soldering processes. The iron-ferrite core provides distinct characteristics compared to powdered iron alternatives. Consider the 3.2 Ω DC resistance impact on circuit efficiency. Verify that the 960 mA current rating meets the peak load demands of the application without saturation.

Part Context

This part belongs to the 10M series of standard RF inductors offered by Gowanda Electronics. The series includes various inductance values ranging from 0.10 µH to higher capacities. These components are designed for aerospace, defense, and medical markets requiring high reliability. The 10M series offers both traditional leaded and RoHS-compliant options.

Replacement Considerations

The SML32-027K is a surface mount alternative with different physical dimensions and mounting requirements. Direct substitution requires evaluating PCB space constraints and soldering process compatibility. Electrical characteristics such as Q-factor and self-resonant frequency should be compared before implementation.