— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:ICI890-44110 IMAGE-CAPTURE
- Series:*
- Mfr:SICK, Inc.
- Package:Box
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Overview
The SICK 1108618 is a V2D611P-MMSCI4 2D snapshot sensor designed for industrial machine vision. It utilizes a CMOS global shutter image sensor with manual adjustable focus and integrated bi-color LED illumination (blue at 470 nm and amber at 617 nm). The device supports the SICK Algorithmus API HALCON and includes a Quality Inspection License, with optional Intelligent Inspection Upgrade capabilities. It features a green feedback LED and a red alignment LED for setup assistance. Classified as Laser Class 1 under 21 CFR 1040.10, it ensures eye safety while providing reliable imaging in automated environments.
Feature Summary
- Equipped with a CMOS global shutter sensor for high-quality 2D snapshot imaging
- Features integrated bi-color LED illumination for versatile lighting conditions
- Supports SICK Algorithmus API HALCON for advanced inspection applications
- Includes built-in quality inspection licensing with upgrade options
Applications
- Quality inspection tasks requiring precise 2D image analysis
- Automated manufacturing processes utilizing HALCON algorithm integration
- Industrial environments necessitating Laser Class 1 eye-safe operation
Procurement Notes
Verify the specific ordering suffix to ensure the correct configuration of software licenses and optical parameters. Confirm compatibility with existing HALCON setups and check for required mounting accessories. Ensure the procurement matches the exact model number 1108618 to secure the intended Quality Inspection License and illumination specifications.
Selection Notes
Select this model when a compact 2D snapshot solution with integrated bi-color lighting is required. It is suitable for applications needing manual focus adjustment and direct integration with HALCON-based inspection algorithms. Consider the optional Intelligent Inspection Upgrade if advanced toolsets are anticipated for future process optimization.
Part Context
This component belongs to the V2D611P series of 2D snapshot sensors from SICK. These devices are engineered for robust industrial use, combining high-performance imaging with flexible connectivity. The series emphasizes ease of integration through standardized interfaces and comprehensive software support, facilitating efficient deployment in modern automated production lines.
Replacement Considerations
Consult official SICK documentation for confirmed substitute part numbers. Verify that any replacement maintains identical interface protocols, mechanical dimensions, and software license compatibility to ensure seamless system integration without modification.
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