— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:PLB X36/5MP PP MEDIUM FOV
- Series:PLB
- Mfr:SICK, Inc.
- Package:Bulk
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Overview
The SICK model 1115871 is a V2D611P-2M3S1 image sensor designed for industrial quality inspection. It features a monochrome CMOS sensor with a global shutter and an adjustable focus lens covering a working area of 50 mm to 300 mm when using internal illumination. The device integrates dual-color LED lighting, including blue (470 nm) and amber (617 nm) sources, alongside a green feedback LED (525 nm) and red alignment LED (630 nm). It supports the SICK Algorithmus API HALCON and includes the Quality Inspection License by default, with optional Intelligent Inspection Upgrade capabilities.
Feature Summary
- Equipped with a monochrome CMOS global-shutter sensor for precise image capture.
- Features integrated dual-color LED illumination for versatile material detection.
- Supports programmable configuration via Nova Inspector software.
- Compatible with the SICK Algorithmus API HALCON for advanced algorithmic processing.
Applications
- Automated optical quality inspection in manufacturing environments.
- Component presence verification and positioning tasks.
- Surface defect detection requiring high-contrast imaging.
Procurement Notes
Verify the specific ordering suffix to confirm included software licenses and cable lengths. Ensure compatibility with existing control systems regarding the supported HALCON API version. Confirm that the required working distance aligns with the specified 50 mm to 300 mm range for optimal focus performance.
Selection Notes
Select this model for applications requiring flexible illumination colors and programmable inspection algorithms. Consider the optional Intelligent Inspection Upgrade License if advanced toolsets are needed beyond the standard Quality Inspection License. Ensure the mounting environment allows for manual focus adjustment and adequate space for the sensor dimensions.
Part Context
This component belongs to the V2D series of 2D snapshot sensors from SICK. These sensors are engineered for robust industrial use, combining high-speed imaging with integrated lighting solutions. The series emphasizes ease of integration through standardized interfaces and comprehensive software support for rapid deployment.
Replacement Considerations
No public confirmed substitute part numbers are available for this specific model variant.
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