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The 11C06DCQB is a high-speed ECL (Emitter-Coupled Logic) series positive edge-triggered D flip-flop manufactured by National Semiconductor. It features complementary outputs and includes an internal 2-input OR gated data input configuration for flexible logic integration. The device is housed in a ceramic flatpack package with a glass-sealed body, designated as CDFP16 or FP-16, containing 16 terminals. It supports operation up to a maximum frequency of 650 MHz and functions within a temperature range of -55°C to 75°C.
Verify the specific ordering suffix 'Q' confirms the required military-grade qualification and ceramic packaging variant. Confirm that the lead time aligns with long-lead component requirements typical for legacy National Semiconductor parts. Ensure compatibility with existing ECL power supply rails and termination networks before procurement. Check for availability of certified datasheets from authorized distributors to validate authenticity.
Select this component when a positive edge-triggered D flip-flop with inherent input gating is required in high-frequency ECL applications. The complementary output capability simplifies differential signaling interfaces without additional inverters. Consider the ceramic flatpack package for superior thermal dissipation and hermetic sealing compared to plastic alternatives. Ensure system design accommodates the specific ECL voltage levels and termination requirements associated with this logic family.
This part belongs to the National Semiconductor 11C06 series, a line of high-performance ECL flip-flops designed for demanding digital applications. The series provides reliable data storage and transfer capabilities at speeds exceeding hundreds of megahertz. As a legacy product from National Semiconductor, now part of Texas Instruments, it remains relevant in specialized markets requiring proven, high-speed logic families with robust packaging options for harsh environments.
Direct substitutes may include other ECL D flip-flops from the same manufacturer family with compatible pinouts and electrical characteristics. Verify equivalent speed grades and input/output configurations when evaluating cross-manufacturer alternatives. Ensure any replacement maintains the required ceramic package style if hermetic sealing is critical for the application environment.