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The Geyer Electronic America, Inc. model 12.92183 is a ceramic surface-mount oscillator operating at 27 MHz with HCMOS output. It functions within a supply voltage range of -0.5V to 7V and draws a maximum current of 11mA during operation. The device features a frequency stability of ±50ppm and supports tri-state output enable functionality. Designed for robust performance, it operates reliably across a temperature range of -40°C to 85°C. The component utilizes a compact 4-SMD, no-lead package measuring 3.20mm by 2.50mm with a maximum height of 0.80mm, ensuring compatibility with standard SMT assembly processes.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging and tape specifications. Confirm that the requested variant matches the required frequency tolerance and output type. Check RoHS compliance status if environmental regulations apply to your project. Ensure the supplier provides valid traceability documents. Cross-reference the part number with the latest datasheet to avoid discrepancies in pinout or electrical characteristics.
Choose this component when a 27 MHz frequency is specifically required for system synchronization. Consider the HCMOS output level compatibility with downstream logic circuits. Evaluate the physical dimensions against available PCB real estate constraints. Assess the operating temperature range against the expected environmental conditions of the final application. Verify power consumption requirements align with the 11mA maximum draw specification.
This oscillator belongs to the KXO-V96 series from Geyer Electronic America, Inc., a manufacturer specializing in frequency control products. The series is designed for applications requiring reliable quartz-based timing solutions in compact form factors. Geyer Electronic has established itself as a provider of precision crystals and oscillators for telecommunications and industrial sectors since its founding in 1964.
Consult the manufacturer's substitution guide for direct replacements. Verify equivalent frequency, voltage, and package dimensions before swapping. Ensure output logic levels match the original design requirements. Check thermal specifications to maintain operational reliability.