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Product Detailed Parameters
- Description:1202570057
- Series:*
- Mfr:Molex
- Package:Bulk
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Overview
Molex part number 1202570057 is an active Board-to-Board connector belonging to the 71436 series. It is a 1.00mm Mezzanine (IEEE 1386) plug designed for surface mount vertical stacking applications. The component features dual row construction with 64 circuits and an unmated height of 6.35mm. It includes robotic placement metal caps and lacks PCB locator pegs. Packaging is provided in embossed tape on reels.
Feature Summary
- Dual row surface mount configuration for vertical board stacking
- Integrated robotic placement metal cap for automated assembly
- Compliant with IEEE 1386 mezzanine standards
Applications
- Board-to-Board interconnects
- Mezzanine circuit connections
Procurement Notes
Verify the specific datasheet for the 71436 series to confirm mechanical tolerances and mating partner compatibility. Ensure procurement channels provide original manufacturer documentation to validate the active status and compliance declarations such as EU RoHS and REACH SVHC containment status before integration into production designs.
Selection Notes
Select this component when a low-profile, high-density connection is required between stacked boards. The 1.00mm pitch supports compact form factors while maintaining signal integrity through IEEE 1386 compliance. Consider the surface mount vertical orientation and robotic placement features for high-volume manufacturing efficiency.
Part Context
This connector is part of Molex's broader portfolio of interconnect solutions, specifically within the 71436 series dedicated to mezzanine applications. It serves as a critical interface element in systems requiring reliable vertical stacking of electronic modules, distinguishing itself from general-purpose board-to-board connectors through its specialized pitch and stacking geometry.
Replacement Considerations
Consult official Molex substitution guides for verified alternatives within the 71436 series or compatible pin-count variants. Do not assume cross-series compatibility without verifying mechanical footprint and electrical specifications against the original design requirements.
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