SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Knowles Syfer 1206J1000221MCTE01 is a three-terminal surface-mount EMI filter capacitor designed for high-frequency noise suppression. It features a C0G (NP0) dielectric material providing stable capacitance characteristics across varying temperatures and voltages. The component operates within a DC voltage rating of 100V and offers a nominal capacitance of 220pF with a tolerance of ±20%. Housed in a standard 1206 (3216 metric) package, it supports operation from -55°C to +125°C. This device integrates feedthrough technology to minimize parasitic inductance, ensuring effective signal integrity in sensitive electronic circuits.
Verify the specific suffix 'MCTE01' against official Knowles Syfer documentation to confirm the exact termination plating and packaging configuration. Ensure compatibility with automated pick-and-place equipment regarding the 1206 footprint dimensions. Cross-reference the datasheet for any recent design changes or environmental compliance updates prior to finalizing procurement orders.
Select this component when space-constrained designs require effective EMI suppression without compromising signal quality. The 1206 package allows for compact PCB layouts while maintaining robust mechanical stability. Consider the C0G dielectric properties for applications demanding precise capacitance stability under thermal stress or variable bias conditions.
This part belongs to the Knowles Syfer E01 series of SMT EMI filters. The series utilizes proprietary flexible termination materials to enhance reliability during board flexing and thermal cycling. These components are engineered for demanding environments, offering improved mechanical performance over conventional MLCCs while maintaining strict electrical specifications for critical filtering tasks.
Consult official substitution guides for compatible three-terminal EMI filters in the 1206 package. Verify that alternative parts match the 100V rating, 220pF capacitance, and C0G dielectric type. Ensure physical dimensions and terminal configurations align with existing PCB footprints to prevent assembly issues.