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The Knowles Syfer 1206Y0500563MJTE07 is a high-reliability multilayer ceramic capacitor (MLCC) in the FlexiCap series. It features a 1206 (3216 metric) surface-mount package with a capacitance of 0.056 µF and a DC voltage rating of 50 VDC. The component utilizes X7R dielectric material with a ±20% tolerance. It incorporates a Nickel Barrier and 100% tin termination system, designed as a 3-terminal EMI filter. The device operates within a temperature range of -55°C to +125°C.
Verify the specific suffix 'MJTE07' against official datasheets to confirm the presence of the nickel barrier and 3-terminal EMI filter configuration. Ensure compatibility with RoHS3 standards and confirm that the reel packaging quantity matches production requirements. Cross-reference the manufacturer part number directly to avoid substitution errors with standard MLCCs lacking the EMI filtering feature.
Select this component when board flexibility is a critical design constraint due to its soft termination structure. The 3-terminal EMI filter capability allows for combined decoupling and noise suppression in a single footprint. Verify that the 50V rating and X7R characteristics meet the circuit's electrical requirements and thermal operating conditions.
This component belongs to the Knowles Syfer FlexiCap family, which specializes in high-reliability capacitors for automotive and industrial sectors. The 1206Y prefix indicates the 1206 case size and X7R dielectric type. The product line is engineered to withstand mechanical stress and harsh environments while maintaining stable electrical performance over time.
Standard 1206 MLCCs lack the soft termination and EMI filtering features. Substitutes must match the 3-terminal EMI filter architecture and nickel barrier construction to maintain reliability in flex-sensitive applications.
The three-terminal design integrates an EMI filter, allowing the component to suppress electromagnetic interference while providing capacitance.
It uses soft terminations to absorb mechanical stress, preventing cracking and failure when the printed circuit board undergoes flexing or warping.