1206Y1000332MJTE03

Overview

The Knowles Syfer 1206Y1000332MJTE03 is a feed-through multilayer ceramic capacitor (MLCC) designed for surface mount technology. It features a capacitance of 3300 pF with a tolerance of ±20%. The component operates at a DC voltage rating of 100 V and utilizes an X7R dielectric material. It is housed in a standard 1206 (3216 metric) package, measuring 3.2 mm in length, 1.6 mm in width, and 1.6 mm in height. The device supports a continuous current of 50 mA and functions within a temperature range of -55°C to +125°C.

Feature Summary

• Integrates feed-through architecture to provide effective electromagnetic interference filtering directly on the signal path.
• Utilizes FlexiCap™ technology to enhance mechanical flexibility and reduce stress on solder joints during board flexing.
• Features nickel barrier terminations to ensure reliable adhesion and resistance to corrosion in harsh environments.

Applications

• High-reliability aerospace and defense electronic systems
• Automotive electronics requiring robust EMI suppression
• Industrial control circuits sensitive to board flexure

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm termination materials and dielectric characteristics. Ensure compatibility with automated pick-and-place equipment regarding the reel packaging format. Confirm that the 50 mA current rating meets the operational requirements of the target circuit design before finalizing procurement.

Selection Notes

Select this component when both high-frequency noise attenuation and mechanical durability are required. The feed-through design offers superior shielding compared to standard MLCCs. Consider the 1206 footprint constraints and the specific need for nickel barrier terminations if lead-free soldering processes are mandated by the assembly specifications.

Part Context

This part belongs to the Knowles Syfer FlexiCap series, which specializes in flexible ceramic capacitors. These components are engineered to withstand mechanical stress that typically causes failure in rigid MLCCs. The series is widely recognized for its use in applications where vibration and thermal cycling induce significant physical strain on the printed circuit board.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify equivalent specifications with alternative manufacturers if direct substitution is necessary.