1449030001

Overview

Molex part number 1449030001 is a Micro-Fit 3.0 Series header connector designed for surface mount technology applications. It features a vertical orientation with a 3.00mm pitch and contains six circuits. The component utilizes a black polyamide housing with tin-plated copper alloy contacts to ensure reliable signal transmission. This specific configuration includes a dual-wipe contact termination system for enhanced reliability during mating cycles.

Feature Summary

• Surface mount vertical header design for automated PCB assembly
• Dual-wipe contact termination for improved electrical connection reliability
• Black polyamide housing material providing thermal stability

Applications

• Consumer electronics internal interconnects
• Industrial control board signal routing
• Automotive infotainment system connections

Procurement Notes

Verify the exact suffix code against the manufacturer's current catalog to confirm housing color and terminal plating specifications. Ensure the selected variant matches the required surface mount footprint dimensions. Cross-reference the revision level to guarantee compatibility with existing tooling and assembly processes.

Selection Notes

Select this component when a low-profile, high-density connection is required on a printed circuit board. The 3.00mm pitch allows for compact layout designs while maintaining adequate spacing for standard manufacturing tolerances. Consider the dual-wipe feature if higher cycle life or vibration resistance is necessary compared to single-wipe alternatives.

Part Context

This connector belongs to the Micro-Fit 3.0 family, which is widely used in mobile devices and portable electronics. The series offers various pin counts and mounting styles to support diverse design constraints. It provides a balance between size reduction and robust mechanical locking capabilities for secure mating.

Replacement Considerations

Direct substitutes may include other manufacturers' 3.0mm pitch SMT headers with identical pin counts and dual-wipe contact structures. Verify that alternative components match the housing height and terminal plating requirements before implementation.