1542656-5

Overview

The 1542656-5 is a connector heat sink manufactured by TE Connectivity AMP Connectors, designed specifically for XFP MSA PCI applications. This component serves as a thermal management solution to dissipate heat generated during operation. It is engineered to fit within the constraints of high-density electronic assemblies requiring efficient cooling mechanisms for small form factor transceivers.

Feature Summary

• Provides thermal dissipation for XFP modules
• Compatible with MSA PCI application standards

Applications

• XFP transceiver thermal management
• MSA compliant optical networking equipment
• PCI interface module cooling

Procurement Notes

Verify current availability status through authorized distributors as supply may be restricted or limited in certain regions. Confirm that the specific part number matches the required XFP MSA PCI application specifications before procurement to ensure compatibility with existing system designs and thermal requirements.

Selection Notes

Select this component when thermal management is required for XFP modules in MSA PCI configurations. Ensure the design accommodates the physical dimensions and mounting requirements of the heat sink to maintain effective thermal contact and structural integrity within the assembly.

Part Context

This component belongs to the range of passive thermal solutions offered by TE Connectivity for high-speed data communication interfaces. It supports the reliability and performance of optical transceivers by maintaining operating temperatures within safe limits, contributing to overall system stability in network infrastructure.

Replacement Considerations

No public confirmed substitute part numbers are available.