15M333JLF

Overview

The 15M333JLF is a fixed molded unshielded RF coil manufactured by Gowanda Electronics. It features an inductance of 330 µH with a maximum DC resistance of 12 ohms and a rated current of 81 mA. The component utilizes axial lead mounting for through-hole integration. It operates within a temperature range of -55°C to 125°C and is designed for general purpose applications requiring reliable performance in constrained environments.

Feature Summary

• Molded construction provides mechanical stability and environmental protection
• Unshielded design minimizes weight and material usage
• Axial lead configuration facilitates standard through-hole PCB assembly

Applications

• General purpose RF circuit filtering
• Industrial electronic signal conditioning
• Aerospace instrumentation components

Procurement Notes

Verify the specific suffix 'LF' confirms lead-free compliance if required by project specifications. Confirm that the unshielded nature aligns with electromagnetic interference constraints. Ensure axial lead dimensions match the target printed circuit board layout before finalizing procurement orders.

Selection Notes

Select this component when a 330 µH inductance value is required with low current handling capabilities around 81 mA. The unshielded type is suitable where magnetic coupling with adjacent components is not a primary concern. Verify thermal requirements against the -55°C to 125°C operating range.

Part Context

Gowanda Electronics specializes in high-performance magnetic components for critical sectors including aerospace, defense, and medical imaging. This part belongs to their line of molded RF coils, which are engineered for reliability in demanding operational conditions. The company maintains rigorous quality standards for these passive electronic elements.

Replacement Considerations

Direct substitutes include the 19M333J, which shares identical electrical parameters but lacks the lead-free designation. Ensure any replacement matches the axial package style and physical footprint to maintain compatibility with existing assembly processes.