163681-1

Overview

The TE Connectivity AMP Connectors 163681-1 is a vertical board-to-board header connector featuring three positions with a 2.5 mm pitch. Designed for single-row mounting, it utilizes tin-plated contacts to ensure reliable signal transmission in compact electronic assemblies. The component is engineered for through-hole installation on printed circuit boards, providing a stable mechanical interface for mating receptacles.

Feature Summary

• Vertical orientation facilitates space-efficient PCB layouts
• Tin-plated contacts provide corrosion resistance and conductivity
• Single-row configuration supports streamlined interconnection

Applications

• Compact electronic device interconnects
• Board-to-board signal routing
• Consumer electronics assembly

Procurement Notes

Verify the specific contact plating material and current rating requirements against the official datasheet before procurement. Confirm that the vertical header style matches the mechanical constraints of the target PCB design. Ensure compatibility with mating receptacles from the same series to guarantee proper engagement and electrical performance.

Selection Notes

Select this component when a low-profile, vertical interconnect solution is required for three-wire circuits. The 2.5 mm pitch offers a balance between density and ease of assembly. Consider the tin plating for general-purpose applications where gold plating is not strictly necessary for high-cycle mating.

Part Context

This part belongs to the TE Connectivity AMP Series of rectangular connectors. It is designed for general-purpose electronic applications requiring reliable vertical interconnection. The series is known for its robust construction and compatibility with various mating components within the same product family.

Replacement Considerations

Check for direct substitutes such as 163681-2 or 163681-5 if different pin counts are needed. Verify mechanical dimensions and electrical ratings against any alternative vendors' offerings to ensure interchangeability without redesigning the PCB footprint.