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17-21/GPC-AK0M1B/3T is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists Everlight Electronics Co Ltd. Its product description is LED GREEN CLEAR 0805 SMD. Review the specifications below when checking this part for your BOM.
The Everlight 17-21/GPC-AK0M1B/3T is a single-color surface-mount LED component manufactured by Everlight Electronics Co Ltd. It utilizes an 0805 package configuration with a total height of 1.0mm, designed for compact board layouts. The device supports infrared and vapor phase reflow soldering processes and is compatible with automatic placement equipment. It is RoHS compliant and halogen-free, ensuring environmental safety standards are met.
Verify the specific color output and peak wavelength parameters against the official Everlight datasheet for part number 17-21/GPC-AK0M1B/3T prior to ordering. Confirm that the 0805 package dimensions and 1.0mm height align with your PCB footprint requirements. Ensure compatibility with your selected reflow soldering profile and automatic placement machinery specifications.
Select this component when a low-profile 0805 SMD LED is required for space-constrained designs. Consider its compatibility with standard reflow processes and automatic assembly lines. Evaluate the specific optical characteristics and color requirements against application needs. Verify environmental compliance status if halogen-free or RoHS certification is mandatory for the target market.
This component belongs to the Everlight 17-21 series of 0805 Package Chip LEDs with a 1.0mm height. The series is designed for surface mount technology applications requiring compact form factors. It serves as a monochromatic light source suitable for various electronic indicator and backlighting functions within consumer and industrial electronics.
Cross-reference other Everlight 17-21 series parts with identical 0805 packaging and 1.0mm height. Verify matching electrical and optical parameters before substitution. Ensure alternative components maintain compatibility with existing reflow profiles and automated placement equipment constraints.
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