Edgeboard Connectors 1700826118 product image

1700826118

$37.59
  • Description:093 COPLANAR+ 118CKT NO CLIPNO S
  • Series:EdgeLine 170082
  • Mfr:Molex
  • Package:Bulk

SKU:0150bc9af151 Category: Brand:

  
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1700826118 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Molex. Its product description is 093 COPLANAR+ 118CKT NO CLIPNO S. Review the specifications below when checking this part for your BOM.

Edgeboard Connectors specifications for 1700826118

  • Description:093 COPLANAR+ 118CKT NO CLIPNO S
  • Series:EdgeLine 170082
  • Mfr:Molex
  • Package:Bulk
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:31; 28
  • Number of Positions:118
  • Card Thickness:0.110" (2.79mm)
  • Number of Rows:2
  • Pitch:0.092" (2.35mm)
  • Read Out:Dual
  • Features:-
  • Mounting Type:Board Edge, Through Hole
  • Termination:Press-Fit
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:30.0µin (0.76µm)
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-40°C ~ 85°C

Edgeboard Connectors datasheet and documents for 1700826118

1700826118

Edgeboard Connectors Overview

The Molex 1700826118 is an EdgeLine CoPlanar+ connector designed for high-speed data transmission with a rated speed of 15 Gbps. It features a 0.80mm pitch and supports a PCB thickness of 2.36mm. The component comprises 118 circuits and utilizes a dual-edge gold contact finish on a black non-specified card type. This surface-mount plug connector is engineered for vertical stacking applications, ensuring reliable board-to-board connectivity in dense electronic assemblies.

Edgeboard Connectors Feature Summary

  • Supports high-speed data transmission up to 15 Gbps
  • Utilizes a 0.80mm pitch for compact board layouts
  • Features encapsulated plugin design for secure engagement
  • Includes robotic placement metal cap for automated assembly

Edgeboard Connectors Applications

  • Board-to-Board interconnects
  • Mezzanine card connections
  • High-density electronic assemblies requiring 15 Gbps throughput

Edgeboard Connectors Procurement Notes

Verify the specific RoHS compliance status and REACH SVHC declarations against current regulatory updates before procurement. Confirm that the 2.36mm PCB thickness requirement aligns with your design specifications. Ensure the 118-circuit configuration matches the target application's signal routing needs. Check for any specific handling instructions related to the encapsulated plugin structure during storage and installation.

Edgeboard Connectors Selection Notes

Select this component when a 0.80mm pitch is required for high-density layouts. Choose it for applications demanding 15 Gbps data rates over board-to-board interfaces. Consider the 2.36mm PCB thickness constraint during mechanical design. Opt for this part if robotic placement capabilities are necessary due to the integrated metal cap feature.

Edgeboard Connectors Part Context

This part belongs to the Molex EdgeLine CoPlanar+ series, which focuses on high-speed, low-profile interconnect solutions. The series is designed to meet IEEE standards for mezzanine connectors, providing reliable performance in space-constrained environments. It complements other high-speed connector families by offering specific pitch and circuit count variations.

Edgeboard Connectors Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with mating receptacles from the same EdgeLine CoPlanar+ family before considering alternatives.

17008261181700826118
$37.59
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