SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Knowles Syfer 1806J1000223MJTE07 is a surface-mount feed-through capacitor designed for high-frequency noise suppression. It features a 1806 (4516 metric) package size with a capacitance of 0.022 µF and a DC voltage rating of 100 VDC. The component utilizes C0G/NP0 dielectric material, ensuring stable performance across varying temperatures. It supports a continuous current of 2 A and offers a tolerance of ±20%. This three-terminal device provides effective EMI filtering in compact electronic designs.
Verify the complete part number including suffixes to ensure correct termination and packaging specifications. Confirm that the required current rating and capacitance tolerance align with the circuit design requirements. Check for RoHS compliance status if environmental regulations apply to the final assembly. Ensure the selected vendor provides authentic components from authorized distribution channels to guarantee reliability.
Select this component when space constraints require a 1806 footprint but higher current handling than standard MLCCs is needed. The C0G dielectric makes it suitable for precision timing or coupling applications where capacitance drift must be minimized. Consider the three-terminal configuration for superior high-frequency attenuation compared to two-terminal alternatives in similar packages.
This component belongs to the Knowles Syfer feed-through capacitor series, which integrates filtering functions directly into the passive component structure. Unlike traditional discrete filters, these devices combine capacitive elements with low-inductance internal connections. The 1806 form factor allows for automated surface-mount placement while maintaining robust electrical performance in dense PCB layouts.
Direct substitutes include other 1806 feed-through capacitors with matching 100V ratings and 0.022µF capacitance. Verify terminal configuration and current ratings before substitution. Alternative brands may offer similar performance but require validation of dimensional compatibility and thermal characteristics.