SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Knowles Syfer 1806J1000392MJTE07 is a feed-through capacitor designed for surface mount technology. It features a 1806 (4516 metric) package with a capacitance of 3900 pF and a DC voltage rating of 100 V. The component utilizes C0G/NP0 dielectric material, ensuring stable performance across a temperature range of -55°C to +125°C. It offers a tolerance of ±20% and supports a continuous current of 2 A. This three-terminal device integrates filtering capabilities directly into the circuit layout.
Verify the specific suffix codes against official manufacturer documentation to confirm terminal configuration and termination plating specifications. Ensure that the selected variant matches the required current rating and package dimensions for the target PCB footprint. Cross-reference the datasheet for any updates regarding RoHS compliance status or recommended soldering profiles prior to final procurement decisions.
Select this component when space-constrained designs require integrated filtering without additional discrete inductors or capacitors. The 1806 package size balances board area efficiency with higher current capacity compared to smaller footprints. Consider the C0G dielectric properties for applications demanding minimal capacitance variation over temperature and voltage changes. Evaluate the 2 A current rating against peak operational loads to prevent thermal degradation.
This part belongs to the Knowles Syfer feed-through capacitor series, which combines the functions of a capacitor and an inductor in a single monolithic structure. These components are engineered to provide superior high-frequency noise attenuation compared to standard MLCCs. The J series typically denotes general-purpose variants within the portfolio, offering reliable performance for broad industrial and commercial applications requiring compact EMI solutions.
Direct replacements must match the 1806 package, 3900 pF capacitance, 100 V rating, and 2 A current capability. Verify that substitute parts maintain the three-terminal feed-through architecture to preserve filtering efficacy. Check for compatible termination materials and solderability characteristics to ensure assembly process compatibility.