SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Knowles Syfer 1806Y0250154MJTE07 is a multilayer ceramic capacitor (MLCC) in an 1806 surface-mount package. It features a capacitance of 150 nF with a tolerance of ±20% and a DC voltage rating of 25 VDC. The component utilizes X7R dielectric material, designated as 2R1. It incorporates FlexiCap technology with nickel barrier end terminations to enhance mechanical reliability. The operating temperature range spans from -55°C to +125°C.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm terminal composition and packaging format. Ensure the procurement channel sources genuine Knowles Syfer components to guarantee compliance with RoHS directives and material specifications. Cross-reference the Mouser number 843-1806Y0250154MJTE07 for accurate identification during sourcing.
Select this component when board flexibility is a primary concern due to its soft termination architecture. The X7R dielectric offers higher volumetric efficiency compared to Class 1 alternatives but exhibits voltage coefficient effects. Verify that the 25V rating and 150nF value align with the circuit's ripple current and bias requirements.
This part belongs to the Knowles Syfer FlexiCap series, which specializes in high-reliability MLCCs for applications prone to mechanical stress. The 1806 case size balances footprint constraints with capacitance density. The MJTE07 suffix indicates specific termination and packaging characteristics defined by the manufacturer.
Direct replacements must match the 1806 footprint, 25V rating, 150nF capacitance, and X7R dielectric. Verify that substitute parts also feature flexible terminations if board flex sensitivity is critical. Check for equivalent nickel barrier construction to maintain environmental reliability standards.
FlexiCap technology uses flexible end terminations to absorb mechanical stress caused by board flexing or thermal expansion, thereby preventing crack formation in the ceramic body.
Yes, the MJTE07 suffix indicates the presence of a nickel barrier layer between the inner electrodes and the outer termination, which enhances reliability and solderability.