1806Y1000124MXTE07

Overview

The Knowles Syfer 1806Y1000124MXTE07 is a surface-mount feed-through capacitor designed for high-frequency noise suppression. It features a 0.12 µF capacitance with a 100 VDC rating and X7R dielectric. The component operates within a temperature range of -55°C to +125°C. Its 1806 (4516 metric) package includes three terminal pads, enabling direct board mounting without additional hardware. This configuration supports efficient PCB layout while providing robust EMI filtering capabilities.

Feature Summary

• Three-terminal feed-through architecture for enhanced electromagnetic interference suppression
• Integrated design eliminates the need for separate mounting hardware or chassis connections
• X7R ceramic dielectric provides stable capacitance characteristics across the operating temperature range

Applications

• High-speed digital signal line filtering
• Power supply input/output noise reduction
• RF circuit grounding and decoupling

Procurement Notes

Verify the specific suffix TE07 against official datasheets to confirm terminal plating and packaging specifications. Ensure the selected variant matches the required current rating and thermal performance for the target application environment before finalizing procurement orders.

Selection Notes

Select this component when board space is limited and superior high-frequency attenuation is required compared to standard two-terminal MLCCs. The three-pad footprint allows for lower inductance paths, making it suitable for sensitive analog or RF sections where signal integrity is critical.

Part Context

This part belongs to the Knowles Syfer feed-through capacitor series, which utilizes a coaxial structure to minimize parasitic inductance. Unlike standard multilayer ceramic capacitors, these components are engineered specifically for applications demanding high current handling and effective common-mode noise rejection in compact form factors.

Replacement Considerations

Direct substitutes require matching the 1806 footprint, 0.12 µF value, and three-terminal feed-through topology. Verify that alternative manufacturers offer compatible current ratings and thermal profiles to ensure seamless integration without redesigning the PCB layout.