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The Knowles Syfer 1806Y1000183MJTE07 is a multilayer ceramic capacitor (MLCC) designed for surface mount technology. It features an 1806 case size with a capacitance of 18 nF and a DC voltage rating of 100 VDC. The component utilizes C0G/NP0 dielectric material, ensuring stable performance across varying conditions. It offers a tolerance of ±20% and operates within a temperature range of -55°C to +125°C. The device incorporates FlexiCap technology with a nickel barrier for enhanced reliability.
Verify the specific suffix codes against official manufacturer documentation to confirm exact termination and packaging specifications. Ensure compatibility with standard SMD reflow profiles. Cross-reference part numbers with authorized distributors to avoid counterfeit components. Confirm RoHS compliance status through current datasheets before integration into production lines.
Select this component for applications requiring stable capacitance values under thermal variation due to its C0G dielectric. The 1806 package offers a balance between capacitance density and physical footprint. Consider the FlexiCap feature for designs subject to board flexing or thermal cycling stresses that might damage rigid terminations.
This part belongs to the Knowles Syfer MLCC portfolio, specifically utilizing FlexiCap technology. It is distinct from standard rigid-termination capacitors by offering improved resistance to cracking. The series is engineered for high-reliability environments, including automotive and industrial sectors, where long-term stability is critical.
Consult official substitution guides for equivalent parts with matching capacitance, voltage, and case dimensions. Verify that alternative components support the required C0G dielectric and FlexiCap termination style if mechanical stress relief is needed.
FlexiCap technology uses flexible end terminations that absorb mechanical stress, significantly reducing the risk of cracking during PCB assembly or operation under thermal cycling.
Yes, the 1806Y1000183MJTE07 includes a nickel barrier layer between the internal electrode and the outer termination to prevent tin-diffusion during soldering.