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The Knowles Syfer 1806Y1000562MXTE01 is a feed-through multilayer ceramic capacitor (MLCC) designed for surface mount technology. It features a capacitance of 5600 pF with a DC voltage rating of 100 V and an X7R dielectric material. The component operates within a temperature range of -55°C to +125°C and utilizes a flexible terminal construction. Packaged in the 1806 (4516 metric) case size, it integrates a pass-through structure for efficient circuit board routing.
Verify the specific suffix designation against the manufacturer's official datasheet to confirm terminal configuration and tolerance specifications. Ensure compatibility with standard reflow soldering profiles compatible with flexible termination materials. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process before procurement.
Select this component when space constraints require a filter that does not obstruct adjacent trace routing. The feed-through design offers superior high-frequency performance compared to standard two-terminal MLCCs. Consider the flexible termination feature if the application involves rigid substrates prone to warping or significant thermal expansion mismatch.
This part belongs to the FlexiCap series of multilayer ceramic capacitors manufactured by Knowles Syfer. The series is characterized by its specialized flexible end terminations designed to improve durability in harsh environments. The 1806Y prefix indicates the specific case dimensions and voltage class within the broader product portfolio.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pinout and electrical equivalence carefully if considering alternative manufacturers' feed-through capacitors.
The feed-through structure allows traces to pass through the component, minimizing parasitic inductance and enabling more compact circuit layouts without sacrificing filtering performance.
Flexible terminations reduce the risk of cracking at the solder joints caused by mechanical stress from PCB flexing or thermal cycling, thereby extending the component's operational life.