1806Y2000273MXTE07

Overview

The Knowles Syfer 1806Y2000273MXTE07 is a surface-mount multilayer ceramic capacitor (MLCC) designed for high-reliability applications. It features a 0.027 µF capacitance with a ±20% tolerance, rated for 200 VDC. The component utilizes C0G/NP0 dielectric material to ensure stable performance across varying conditions. Housed in an 1806 (4516 metric) package, it operates within a temperature range of -55°C to +125°C and complies with RoHS standards.

Feature Summary

• Utilizes C0G/NP0 dielectric for minimal capacitance variation over voltage and temperature changes
• Features flexible termination technology to reduce mechanical stress on the substrate
• Designed for board-flex sensitive environments to prevent cracking during assembly or operation

Applications

• Board-flex sensitive circuit designs
• High-frequency signal coupling and decoupling
• Precision timing and oscillator circuits

Procurement Notes

Verify the specific suffix configuration against official datasheets to confirm terminal plating and packaging details. Ensure compatibility with standard SMT reflow profiles. Confirm RoHS compliance status for your region's regulatory requirements before finalizing procurement specifications.

Selection Notes

Select this component when high stability and low dielectric absorption are critical. The C0G/NP0 dielectric ensures consistent performance without significant drift. Consider the 1806 footprint for space-constrained layouts requiring robust mechanical integrity under thermal cycling.

Part Context

This part belongs to the Knowles Syfer FlexiCap series, which specializes in capacitors with soft terminations. These components are engineered to withstand mechanical stress caused by PCB flexing, making them suitable for rigid-flex boards or applications subject to vibration and thermal expansion mismatches.

Replacement Considerations

Direct substitutes must match the 1806 footprint, 200V rating, 0.027µF value, and C0G/NP0 dielectric. Verify that alternative parts also feature flexible terminations if board-flex sensitivity is a design constraint.