180NQ045

Overview

The Vishay 180NQ045 is a high-current Schottky rectifier module rated for 45 V maximum DC reverse voltage and 180 A average forward current. It utilizes a Half-Pak module case style with a junction temperature range of -55°C to 150°C. The device features a maximum forward voltage drop of 0.60 V at 180 A and a peak non-repetitive surge current capability of 25,500 A. Thermal resistance from junction to case is specified at 0.30°C/W.

Feature Summary

• Optimized proprietary barrier technology ensures reliable operation up to 150°C junction temperature.
• Unique high-power Half-Pak module design offers lower profile and easier mounting compared to parallel DO-5 configurations.
• High purity, high-temperature epoxy encapsulation provides enhanced mechanical strength and moisture resistance.
• Guard ring structure enhances ruggedness and long-term reliability under high-frequency switching conditions.

Applications

• Switching power supplies
• DC-DC converters
• Free-wheeling diodes in inductive circuits
• Reverse battery protection systems

Procurement Notes

Verify the specific suffix code (e.g., PBF) against the manufacturer's current datasheet to confirm RoHS compliance status and exact pinout configuration. Confirm thermal interface material requirements and mounting torque specifications (40-58 kg-cm) during integration planning. Ensure heatsink surface smoothness and greasing meet the typical thermal resistance criteria of 0.15°C/W for optimal performance.

Selection Notes

Select this component when high average current handling and low forward voltage drop are critical for efficiency. The 45V rating suits applications requiring moderate reverse voltage blocking. Consider the Half-Pak package for space-constrained designs needing higher current density than standard discrete packages. Evaluate thermal management capabilities given the 0.30°C/W junction-to-case resistance and 150°C operating limit.

Part Context

This part belongs to the 180NQ series of high-current Schottky rectifiers designed for robust industrial and automotive environments. The Half-Pak module format consolidates multiple internal elements into a single unit, replacing traditional parallel discrete diode arrangements. This integration simplifies PCB layout and improves thermal dissipation characteristics compared to older DO-5 based solutions.

Replacement Considerations

Public confirmed substitute part numbers: None identified in source material.