1812J5000562MXTE03

Overview

The Knowles Syfer 1812J5000562MXTE03 is a multilayer ceramic capacitor (MLCC) in an 1812 surface-mount package. It features X7R dielectric with a capacitance of 5.60 nF and a tolerance of ±20%. The component has a DC voltage rating of 500V and utilizes a nickel barrier electrode structure with 100% tin terminations. Designed for high-reliability environments, it meets AEC-Q200 automotive qualification standards.

Feature Summary

• X2Y architecture providing integrated common-mode filtering capabilities
• AEC-Q200 qualified for automotive electronic applications
• Nickel barrier electrode construction ensuring robust performance

Applications

• Automotive electronics systems requiring EMI suppression
• High-voltage circuit decoupling and filtering
• Common-mode noise reduction in sensitive signal lines

Procurement Notes

Verify the specific suffix configuration against official datasheets to ensure correct termination and dielectric specifications. Confirm AEC-Q200 compliance requirements match your design needs. Check current availability status as supply levels may vary by region. Ensure compatibility with standard reflow soldering profiles for 1812 packages.

Selection Notes

Select this component when integrating X2Y functionality into space-constrained designs. The 500V rating supports high-voltage applications within the 1812 footprint. Consider the X7R temperature stability characteristics for operating environments ranging from -55°C to +125°C. Evaluate the trade-off between integrated filtering and discrete components for board space optimization.

Part Context

This part belongs to the Knowles Syfer X2Y capacitor family, which combines three-terminal filtering technology with MLCC construction. The series is designed to replace multiple discrete components, reducing board area and improving reliability in noise-sensitive applications.

Replacement Considerations

Direct substitutes include other X2Y capacitors with matching 5.6nF capacitance and 500V ratings. Verify terminal material and package dimensions for mechanical compatibility. Ensure equivalent thermal and electrical performance metrics are maintained.