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The Knowles Syfer 1812Y0250105MXTE07 is a Class 2 multilayer ceramic capacitor (MLCC) featuring X7R dielectric characteristics. It offers a capacitance of 1 µF with a ±20% tolerance and a DC voltage rating of 25 VDC. Designed in the 1812 (4532 metric) surface-mount package, this component integrates a three-terminal EMI filter structure. It utilizes FlexiCap technology with nickel barrier end terminations to enhance mechanical reliability under board flex conditions.
Verify the specific suffix 'E07' against official Knowles Syfer documentation to confirm the three-terminal EMI filter configuration and FlexiCap termination style. Ensure compatibility with automated placement equipment due to the unique terminal geometry. Confirm RoHS compliance status through current manufacturer declarations prior to integration.
Select this component when both high capacitance density and electromagnetic interference suppression are required in a compact form factor. The FlexiCap design makes it suitable for applications subject to mechanical vibration or PCB warpage. Verify that the 25V DC rating meets the circuit's peak voltage requirements including ripple and transient spikes.
This part belongs to the Knowles Syfer FlexiCap series, which specializes in high-reliability capacitors designed for harsh environments. The 1812Y series designation indicates the 1812 case size and general product family. These components are engineered to meet stringent automotive and industrial standards, offering enhanced durability compared to standard MLCCs.
Publicly confirmed substitute part numbers are not available in the provided source data. Cross-referencing requires matching the 1 µF value, 25V rating, 1812 package, and specifically the three-terminal EMI filter topology with flexible terminations.
The third terminal connects to an internal ground electrode, forming a low-pass filter structure that shunts high-frequency noise to ground while passing the signal or power line.
FlexiCap uses flexible end terminations with nickel barriers to absorb mechanical stress, significantly improving resistance to cracking during PCB bending or thermal cycling compared to rigid terminations.