1812Y1000272MJTE03

Overview

The Knowles Syfer 1812Y1000272MJTE03 is a feed-through multilayer ceramic capacitor designed for surface mount technology. It features an 1812 (4532 metric) case size with a capacitance of 2700 pF and a voltage rating of 200 VDC. The component utilizes X7R dielectric material, providing a tolerance of ±20%. It operates within a temperature range of -55°C to +125°C and includes a 50 mA current rating.

Feature Summary

• Integrated feed-through architecture provides effective electromagnetic interference filtering in a compact surface-mount footprint.
• X7R dielectric material ensures stable capacitance performance across the specified operating temperature range.
• Designed for board-flex sensitive applications with AEC-Q200 automotive qualification standards.

Applications

• Automotive electronic systems requiring robust EMI suppression
• Printed circuit boards susceptible to mechanical flex stress
• High-frequency signal line filtering in industrial equipment

Procurement Notes

Verify the complete part number including the suffix to ensure correct termination and packaging specifications. Confirm that the 200V DC rating and 50mA current limit align with the target circuit requirements. Check for RoHS compliance status and moisture sensitivity level before procurement planning.

Selection Notes

Select this component when high-frequency noise suppression is required alongside mechanical durability. The feed-through design offers superior shielding compared to standard MLCCs. Ensure the PCB layout accommodates the specific pad configuration required for feed-through mounting styles.

Part Context

This component belongs to the Knowles Syfer FlexiCap series, which specializes in capacitors with flexible terminations. The series targets applications where standard rigid terminations may fail due to substrate warping or vibration. The 1812Y prefix indicates the 1812 case size and X7R dielectric classification.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing footprints if considering alternative manufacturers, as feed-through components often require specific pad layouts distinct from standard MLCCs.