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The Knowles Syfer 1812Y2000103MXTE03 is a pass-through multilayer ceramic capacitor (MLCC) from the FlexiCap series. It features a capacitance of 0.01 µF with a ±20% tolerance and a DC voltage rating of 200V. The component utilizes X7R dielectric material, ensuring stability across an operating temperature range of -55°C to +125°C. Housed in a 1812 (4532 metric) surface-mount package, it measures 4.50mm x 3.20mm with a maximum height of 2.10mm. This E03 type device is designed for high-reliability applications requiring robust mechanical performance.
Verify the complete part number including the E03 suffix to ensure correct pass-through configuration. Confirm RoHS3 compliance status as required by project specifications. Check manufacturer datasheets for specific handling guidelines regarding flexible terminations. Ensure compatibility with standard surface-mount assembly processes. Validate packaging format availability for production requirements.
Select this component when high current carrying capability is required alongside decoupling functions. The pass-through design eliminates the need for separate vias or traces for current paths. Consider the 1812 footprint for adequate thermal dissipation and mechanical strength. Evaluate the 200V rating against peak circuit voltages. Compare physical dimensions against available PCB real estate constraints.
This component belongs to the Knowles Syfer FlexiCap family, which specializes in flexible termination MLCCs. The 1812Y prefix indicates a pass-through variant within the 1812 case size. These devices are engineered for demanding environments where standard MLCCs might fail due to mechanical stress. The series offers improved reliability compared to traditional rigid-termination capacitors in similar form factors.
Direct substitutes must match the 1812 pass-through form factor and 200V rating. Verify that alternative components also feature flexible terminations if mechanical stress is a concern. Ensure equivalent X7R dielectric properties for temperature stability. Cross-reference pinout and electrical parameters with original datasheets before implementation.
It allows high currents to flow directly through the component, reducing trace congestion and improving current handling capacity.
Yes, it is designed for surface-mount technology and compatible with standard reflow soldering profiles.