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The Knowles Syfer 1812Y2000104MXTE03 is a surface-mount multilayer ceramic capacitor (MLCC) designed for high-reliability applications. It features an X7R dielectric material providing stable capacitance over a wide temperature range. The component operates at a rated DC voltage of 200V with a nominal capacitance of 100nF and a tolerance of ±20%. Housed in a standard 1812 (4532 metric) package, it incorporates FlexiCap flexible termination technology to enhance mechanical durability against board flex stress. This part is certified to AEC-Q200 standards, ensuring suitability for automotive electronics environments.
Verify the specific suffix configuration against official Knowles Syfer documentation to ensure correct termination and barrier layer specifications. Confirm AEC-Q200 certification status through authorized channels. Check current supply chain availability as automotive-grade components may experience allocation constraints. Ensure storage conditions comply with moisture sensitivity level requirements prior to reflow soldering.
Select this component when board flex resistance is critical for maintaining electrical integrity in rigid-flex or large PCB designs. The X7R dielectric offers a balance of volumetric efficiency and temperature stability suitable for general-purpose decoupling. Verify that the 200V rating exceeds peak transient voltages in the target application circuit. Consider the 1812 footprint compatibility with existing assembly equipment and stencil designs.
This part belongs to the Knowles Syfer 1812Y series, which specializes in high-capacitance MLCCs utilizing proprietary FlexiCap technology. The series targets automotive and industrial sectors requiring robustness against mechanical stress. The MXTE03 designation indicates specific termination and packaging variations within the broader 1812Y product family, emphasizing automotive qualification and flexible end-terminations.
Direct substitutes must match the 1812 footprint, 200V rating, 100nF capacitance, X7R dielectric, and AEC-Q200 qualification. Verify that alternative parts also feature flexible terminations if board flex mitigation is required. Cross-reference manufacturer-specific termination structures to ensure compatible solderability and mechanical performance.