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19-213/G6C-AP1Q2/3T is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists Everlight Electronics Co Ltd. Its product description is LED YLW-GRN CLEAR 0603 SMD. Review the specifications below when checking this part for your BOM.
The 19-213/G6C-AP1Q2/3T is a single-color surface-mount LED manufactured by Everlight Electronics Co Ltd. It emits brilliant yellow-green light with a peak wavelength of 574nm. The component utilizes an AlGaInP chip and features a white diffused lens. Designed for the 0603 (1608 Metric) package, it measures 1.60 x 0.80mm with a height of 0.60mm. The device operates within a temperature range of -40°C to +85°C and supports standard infrared and vapor phase reflow soldering processes.
Verify the specific ordering suffix against the official Everlight datasheet to confirm exact optical and electrical characteristics. Ensure the component matches the required package dimensions and thermal specifications for the target application. Confirm availability status through authorized channels as supply levels may fluctuate. Cross-reference the part number with current RoHS compliance documentation to meet regulatory requirements.
Select this component when a compact yellow-green indicator is required for space-constrained designs. The 0603 form factor suits high-density PCB layouts. Consider the forward voltage and viewing angle requirements relative to the circuit design. Verify that the operating temperature range aligns with the environmental conditions of the end product.
This part belongs to the 19-213 series of SMD Taping LEDs from Everlight. These components are designed to replace larger lead-frame types, allowing for smaller equipment sizes. The series is characterized by lightweight construction and suitability for miniature applications across consumer electronics and industrial sectors.
Consult the Everlight Device Selection Guide for direct substitutes within the same series. Verify pin compatibility and spectral output when considering alternative manufacturers. Ensure any replacement maintains the same package footprint and reflow profile capabilities.
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