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Product Detailed Parameters
- Description：ISOLATED DRIVER
- Series：EiceDRIVER™
- Mfr：Infineon Technologies
- Package：Tape & Reel (TR),Cut Tape (CT)
- Technology：Magnetic Coupling
- Number of Channels：1
- Voltage - Isolation：3000Vrms
- Propagation Delay tpLH / tpHL (Max)：50ns, 50ns
- Pulse Width Distortion (Max)：5ns
- Rise / Fall Time (Typ)：20ns, 20ns (Max)
- Current - Output High, Low：6A, 6.5A
- Current - Peak Output：6A, 6.5A
- Voltage - Forward (Vf) (Typ)：-
- Voltage - Output Supply：14V ~ 32V
- Grade：-
- Qualification：-
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.295", 7.50mm Width)
- Supplier Device Package：PG-LDSO-8
- Common Mode Transient Immunity (Min)：300kV/µs
- Approval Agency：UL
- Current - DC Forward (If) (Max)：-
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Overview
The Infineon Technologies 1ED3144MC12HXUMA1 is a single-channel isolated gate driver from the EiceDRIVER X3 Compact series. It utilizes coreless transformer technology for signal transmission across the isolation barrier. The device features a PG-LDSO-8 surface-mount package and supports input voltages between 3 V and 15 V. It delivers a maximum continuous output current of 6.5 A with propagation delays up to 50 ns. Operating temperatures range from -40 °C to +125 °C, with an insulation voltage of 1.249 kV.
Feature Summary
- Single-channel electrical isolation using coreless transformer technology
- Active shutdown and short-circuit clamp functionality
- Independent output with undervoltage lockout referenced to GND2 or adjustable options
Applications
- Electric vehicle charging systems
- Solar inverters
- Server and telecom switch mode power supplies
- High-voltage DC-DC converters
Procurement Notes
Verify the complete part number including suffixes to ensure correct packaging and specifications. Confirm that the requested variant matches the required isolation voltage and package type. Check manufacturer datasheets for latest revision status and compliance certifications before finalizing procurement orders.
Selection Notes
Select this component for applications requiring high-speed switching with robust isolation. Ensure the design accommodates the specified input voltage range and peak output current capabilities. Verify thermal management requirements for the PG-LDSO-8 package under expected operating conditions and load profiles.
Part Context
This part belongs to the EiceDRIVER X3 Compact family, designed for driving IGBTs and SiC MOSFETs. It offers a compact footprint suitable for space-constrained designs while maintaining high performance metrics for modern power electronics applications.
Replacement Considerations
Consult official replacement lists for direct substitutes within the same product family. Verify pin compatibility and electrical parameter equivalence before swapping components in existing designs.
