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The Microsemi Corporation 1EZ130D/TR8 is a silicon Zener diode designed for voltage regulation applications. It features a nominal Zener voltage of 130 V with a tolerance of ±10%. The device supports a maximum power dissipation of 1 W and operates within a temperature range of -65°C to +175°C. Packaged in the DO-204AL (DO-41) axial leaded format, it utilizes a plastic encapsulation. The component is supplied in tape and reel packaging, facilitating automated surface-mount or through-hole assembly processes.
Verify the specific suffix designation against official Microsemi documentation to confirm package type and packaging configuration. Ensure the procurement source provides valid traceability data for quality assurance. Confirm RoHS compliance status if required by environmental regulations. Cross-reference the manufacturer part number with current datasheets to validate electrical parameters before integration into design specifications.
Select this component when a 130 V regulation point is required with high thermal stability. The 1 W power rating suits moderate current applications. The DO-41 package allows for standard through-hole mounting techniques. Consider the ±10% tolerance for budgeting voltage accuracy in the final circuit design. Evaluate the operating temperature range against the intended environmental conditions.
This component belongs to the Microsemi 1EZ series of Zener diodes, which are characterized by robust construction and wide operating temperature ranges. The series offers various voltage ratings and power dissipation capabilities. The 1EZ130D variant specifically targets applications needing higher voltage regulation points within the single-watt class. The TR8 suffix indicates a specific tape and reel quantity configuration for manufacturing efficiency.
Direct replacements must match the 130 V Zener voltage, 1 W power rating, and DO-41 package. Verify that substitute components meet the same ±10% tolerance and thermal specifications. Check for equivalent reverse leakage current characteristics. Ensure the replacement maintains compatibility with the existing PCB footprint and assembly process.