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1MM-HU-D33-VS-00-F-TBP is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is SCL 1.0 HDR DRVT USP 066 SMT G1. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 1MM-HU-D33-VS-00-F-TBP is a surface mount board-to-board connector header from the AMPMODU 1MM series. It features 66 positions with a 1.00mm pitch and two rows. The contacts are gold-plated copper alloy pins, while the housing is black liquid crystal polymer rated UL94 V-0. Designed for pick-and-place assembly, it supports a maximum operating temperature of 125°C and a rated current of 1A at 30VAC.
Verify the specific ordering suffix to confirm contact plating thickness and packaging type. Ensure compatibility with standard SMT reflow profiles. Confirm that the 1.00mm pitch matches the target PCB footprint requirements. Check for any specific handling instructions related to the LCP material properties during assembly.
Select this component when a low-profile, high-density header is required for surface mounting. The 1.00mm centerline allows for compact designs compared to larger pitch alternatives. Verify that the 66-position count aligns with the signal or power distribution needs of the specific circuit design.
This part belongs to the AMPMODU 1MM Small Centerline system, designed for space-constrained applications. The series offers various configurations including receptacles and headers. This specific model is a dual-row header intended for vertical surface mount installation on printed circuit boards.
Direct substitutes within the same series include 1MM-HU-D33-VS-00-H-TBP, which differs primarily in contact plating specifications. Other variants in the 1MM family may share mechanical dimensions but require verification of electrical ratings and material compatibility before interchange.
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