1N2978A

Overview

The Microchip Technology 1N2978A is a 10 W silicon Zener diode with a nominal regulation voltage of 14 V and a tolerance of ±5%. It features an internal solder bond construction and is hermetically sealed. The device operates within a temperature range of -65°C to 175°C and utilizes a DO-213AA (DO-4) stud-mount package.

Feature Summary

• Hermetically sealed welded construction for environmental protection
• Internal solder bond design ensuring mechanical stability
• High power dissipation capability of 10 W
• Wide operating temperature range suitable for harsh environments

Applications

• Military-grade electronic circuits
• Industrial voltage regulation systems
• High-reliability power supply protection

Procurement Notes

Verify the specific revision suffix and qualification level (e.g., JAN, JANTX) required for your application, as these affect performance specifications. Confirm that the DO-213AA mounting interface matches your chassis or heatsink design. Ensure thermal management strategies account for the 10 W power dissipation rating under maximum load conditions.

Selection Notes

Select this component when a high-power, hermetically sealed Zener diode is required for critical voltage reference applications. The 14 V nominal value and ±5% tolerance define the regulation point. Consider the stud-mount form factor for efficient heat transfer in high-power density designs where standard surface-mount packages are insufficient.

Part Context

This part belongs to the 1N2970 series of 10 W Zener diodes manufactured by Microchip Technology. The series offers various voltage ratings between 3.9 V and 200 V. These diodes are designed for general-purpose voltage regulation and are often qualified for military standards, providing robust performance in demanding operational scenarios.

Replacement Considerations

Compatible substitutes include other 10 W, 14 V Zener diodes in the DO-213AA/DO-4 package from manufacturers such as Semitronics Corp. Verify that any replacement maintains the same hermetic sealing and internal solder bond construction to ensure equivalent reliability.