1N2991RB

Overview

The Microchip Technology 1N2991RB is a single Zener diode designed for voltage regulation applications. It features a nominal Zener voltage of 36 V with a tolerance of ±5%. The device supports a maximum power dissipation of 10 W and operates with a test current of 70 mA. It utilizes a DO-213AA (DO-4) stud-mount package, providing robust thermal management capabilities suitable for high-power environments.

Feature Summary

• Hermetically sealed welded construction for environmental reliability
• Internal solder bond design ensuring mechanical stability
• Stud-mount configuration for efficient heat dissipation

Applications

• Power supply voltage regulation
• Circuit protection against overvoltage
• Reference voltage generation in industrial equipment

Procurement Notes

Verify the manufacturer origin, as this part number has been produced by multiple entities including Solid State Inc. and Microchip Technology. Confirm the specific datasheet version to ensure alignment with required electrical tolerances and physical dimensions. Check for any ordering suffixes that may indicate polarity variations or specific packaging configurations before finalizing procurement orders.

Selection Notes

Select this component when a 36 V regulation point is required with significant power handling capacity. The stud-mount package necessitates appropriate mounting hardware and thermal interface materials. Ensure the application environment allows for direct chassis or heatsink attachment to maintain safe operating temperatures under full load conditions.

Part Context

This component belongs to the family of 10-watt Zener diodes commonly used in rugged electronic systems. The 1N2991RB specifically addresses the need for stable voltage reference in high-current scenarios where surface-mount technologies are insufficient due to thermal constraints.

Replacement Considerations

Cross-reference with other manufacturers' 1N2991 equivalents such as those from ON Semiconductor or Vishay. Verify pinout compatibility and thermal resistance values to ensure seamless integration without redesigning the mounting structure.